GenX-130P
Made in the USA

High Quality NDT X-Ray Imaging Solutions for PCB Analysis, Medical Device Inspection, Porosity Analysis and Custom Applications.
Designed Specifically for Quality Control, Production Process Validation, Research and Development, and MRO applications.
Detect a wide range of manufacturing/process defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, die attach, component cracking, mis-alignment, and bridging with automated inspection routines resulting in Pass/Fail Analysis.
- Truly Remarkable Image Clarity with proprietary HD Camera and Software
- Compact System, PCB sizes up to 21”(533mm) X 17.5” (445mm)
- Customizable Flat Panel Detectors or Image Intensifier options to meet your application requirements
- 130kV, 16W, 5um to 6um X-Ray tube, 0.18mA with Magnification up to 665X
- Programmable 4 Axis ( X,Y, Z1/Z2) fully motorized Motion Control
- BGA/QFN/Flip Chip Software Pass/Fail – Sphere Size - Void * 3D Gray Scale Option
- Wide Range of Analysis and Enhancement Tools Powered by PXI Technology
- Frame Averaging, Quad View Analysis, Image Filters, Reporting, More…
- Tilt/Rotate Oblique View and LED Targeting System Options
- Flexible and EASY-To-OPERATE system controls and Software
- Engineered for Low Maintenance and Trouble Free Operation
- Quality Built Made in the U.S.A. Supported Worldwide
Intelligent X-Ray Software
Powerful Image Processing Algorithms and Analysis Tools for X-Ray Inspection
Analyze BGA’s, QFN’s and related bottom terminated devices automatically to render detailed pass/fail reporting for complex multi-layered/double-sided board designs. Easily recall or import settings for the best image quality utilizing user created system setting templates stored to the library.
- Detect, Analyze, Report
- Voiding (individual pocket percentage and cumulative percentage totals)
- BGA Sphere Circularity
- Pass/Fail Detection
- Bridging
- (Optimum Pro Module Standard)




- Sharpen, Smooth, Edge Detect, Emboss, Background Subtract,
Negative, 3D Gray Plot, Psuedo Color, Image Histogram - Post Capture Image Enhancement Library
- Point to point Distance Measurement tool
- Image Annotation Tools
- Quad View
- Bond Wire Sweep
- Die Attach Void Measurement
- Pass/Fail Analysis
- Joint Area Measurement
- Percent Void
- Pass/Fail Analysis
- Center to Center Offset (X,Y) Measurement.
Video
Specifications
Dimensions | 57” (H) x 33” (W) x 44” (D) |
Footprint | 10.0 sq. ft. (0.86 sq. m) |
Weight | 2000 Ibs. (907 kg) |
Safe operating temperature | 32° to 99° F (0 to 40°C) |
Power consumption | 500 watts at 120 VAC |
Line voltage | 110/230 VAC 50/60 Hz |
Energy | 130kV, 0.356mA |
Power | 16 Watts maximum |
Focal spot size | 6 micron (auto adjusting w/power) |
Detector type (Options) | 4/2” (10cm x 5cm) dual view X-Ray Image Intensifier with HD Camera |
2” x 2” Flat Panel Detector FPD (16,000+ Gray Scale) | |
4.7” x 5.9” Flat Panel Detector FPD (16,000+ Gray Scale) | |
*Special Application Detectors/Intensifiers also available. | |
Camera | HD, 1920 x 1080 pixels with zoom lens |
Video output | USB 3.0 |
Video display | High-resolution 23” flat panel LCD color monitor |
Field-of-view | Variable |
Max inspection area | 15.5” (X) x 18“ (Y) on table surface / 39.4cm (X) x 45.7cm (Y) |
Max board handling | 17.5” x 21.5“ (445mm x 533mm) board size |
Spatial resolution | >40 lp/mm |
Magnification | >665X |