GenX-130P

High Powered Performance, Compact X-Ray System
PDR GenX 130
• BGA Inspection/Analysis
• Failure Analysis
• Counterfeit Inspection
• Wire Bond Inspection
• LED Inspection
  • Truly Remarkable Image Clarity with proprietary HD Camera and Software
  • Compact System, PCB sizes up to 21”(533mm) X 17.5” (445mm)
  • Customizable Flat Panel Detectors or Image Intensifier options to meet your application requirements
  • 130kV, 16W, 5um to 6um X-Ray tube, 0.18mA with Magnification up to 665X
  • Programmable 4 Axis ( X,Y, Z1/Z2) fully motorized Motion Control
  • BGA/QFN/Flip Chip Software Pass/Fail – Sphere Size - Void * 3D Gray Scale Option
  • Wide Range of Analysis and Enhancement Tools Powered by PXI Technology
  • Frame Averaging, Quad View Analysis, Image Filters, Reporting, More…
  • Tilt/Rotate Oblique View and LED Targeting System Options
  • Flexible and EASY-To-OPERATE system controls and Software
  • Engineered for Low Maintenance and Trouble Free Operation
  • Quality Built Made in the U.S.A.  Supported Worldwide
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BGA Inspection
BGA Inspection
PCB X-Ray
PCB X-Ray
QFP Solder
QFP Solder
SMT Connector
SMT Connector
QFN Inspection
QFN Inspection
Counterfeit
Counterfeit
Bridging
Bridging
Opens
Opens
Voids
Voids
QFN Voiding
QFN Voiding
Mis-Alignment
Mis-Alignment
Wire Bond
Wire Bond

Intelligent X-Ray Software

Powerful Image Processing Algorithms and Analysis Tools for X-Ray Inspection

Analyze BGA’s, QFN’s and related bottom terminated devices automatically to render detailed pass/fail reporting for complex multi-layered/double-sided board designs. Easily recall or import settings for the best image quality utilizing user created system setting templates stored to the library.

  • Detect,  Analyze, Report
    • Voiding (individual pocket percentage  and cumulative percentage totals)
    • BGA Sphere Circularity
    • Pass/Fail Detection
    • Bridging
    • (Optimum Pro Module Standard)
Xray Software
Xray Software
Xray Software
Xray Software
Image Processing Filters and Enhancement Tools
  • Sharpen,  Smooth, Edge Detect, Emboss, Background Subtract,
    Negative, 3D Gray Plot, Psuedo Color, Image Histogram
  • Post Capture Image Enhancement Library
  • Point to point Distance  Measurement tool
  • Image Annotation Tools
  • Quad View
Semiconductor Measurement Tools (Pro Advanced Module)
  • Bond Wire Sweep
  • Die Attach Void Measurement
  • Pass/Fail Analysis
Gull Wing, QFP, SOIC, Measurement tools (Pro Advanced Module)
  • Joint Area Measurement
  • Percent Void
  • Pass/Fail Analysis
Drill Offset Measurement (Pro Advanced Module)
  • Center to Center Offset (X,Y) Measurement.

Specifications

Physical Dimensions
Dimensions57” (H) x 33” (W) x 44” (D)
Footprint10.0 sq. ft. (0.86 sq. m)
Weight2000 Ibs. (907 kg)
Safe operating temperature32° to 99° F (0 to 40°C)
Power consumption500 watts at 120 VAC
Line voltage110/230 VAC 50/60 Hz
.
X-Ray Source
Energy130kV, 0.356mA
Power16 Watts maximum
Focal spot size6 micron (auto adjusting w/power)
.
Image Detector
Detector type (Options)4/2” (10cm x 5cm) dual view X-Ray Image Intensifier with HD Camera
2” x 2” Flat Panel Detector FPD (16,000+ Gray Scale)
4.7” x 5.9” Flat Panel Detector FPD (16,000+ Gray Scale)
*Special Application Detectors/Intensifiers also available.
CameraHD, 1920 x 1080 pixels with zoom lens
Video outputUSB 3.0
Video displayHigh-resolution 23” flat panel LCD color monitor
.
Image Performance
Field-of-viewVariable
Max inspection area15.5” (X) x 18“ (Y) on table surface / 39.4cm (X) x 45.7cm (Y)
Max board handling17.5” x 21.5“ (445mm x 533mm) board size
Spatial resolution>40 lp/mm
Magnification>665X
.

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