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IR-E6 Evolution Series

Ultimate Performance, BGA Rework Station for small-large PCBs upto 24"/620mm

PDR IR-E6

The IR-E6 Evolution rework system is made in the United Kingdom with only the finest components for optimum precision. The PDR IR-E6 is our largest system and one of the best performing BGA Rework Stations worldwide.

The IR-E6 is very high powered with a multi-zone,  PCB preheater and is designed to rework medium to large PCB assemblies with upto a 24”/620mm PCB capacity. It is loaded with advanced features delivering many benefits including the highest performance and soldering quality available anywhere, yet it remains simple to set up and use.

The IR-E6 system is now available in 2 models - the E6S and E6XL. Made in the United Kingdom with only the finest components for optimum precision, the PDR IR-E6 is one of the best performing BGA Rework Stations worldwide.
 

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High Performance

The PDR IR-E6 SMD/BGA rework station, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.

The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.

The IR-E6 is well specified yet can be easily configured to your exact requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4500 customers.

The PDR IR-E6 systems are available in 2 models – E6S and E6XL each configured perfectly for their respective roles.

PDR IR-E6S

Developed from PDR’s pioneering IR rework stations from the 1990-2000s, the IR-E6S, is the standard of the E6 Series. Featuring: Focused IR Component heating, gantry X/Y heater movement. 18” board capabilities with our 3000w 3-zone IR PCB preheating, precision mechanics, precision optical alignment and advanced thermal control. The E3S system is flexible, upgradeable and ideal for general purpose SMD/BGA rework on small-medium sized PCBs.

PDR IR-E6 XL

The larger variant of the IR-E6. The IR-E6XL is one of the largest systems out on the market. With board capabilities up to 24” this system features our largest 3200W 3-Zone IR PCB preheating. Designed for optimum control while still being simple, flexible and reliable to use and operate while reworking Large PCB assemblies.

Simple BGA Procedure

BGA rework poses the problem of accessing hidden interconnects in a high density environment. Consequently, it requires a system that is able to access the hidden joints without affecting neighbouring components. A system that is safe, gentle, adaptable and, above all, simple to operate. The IR-E6 is such a system. It is so easy to operate that technicians are able to instantly achieve excellent process control for BGA/SMD rework without the complexities and frustrations normally associated with ‘high-end’ rework systems.

Paste - Place - Reflow

With the aid of excellent mechanics, optics and control, operators can simply pick up the fluxed BGA from the nest, align it, place it onto the PCB’s pads and then reflow with the system’s accurate PC based, closedloop component and PCB temperature control.

Advanced Features

PDR IR ReworkNo NozzlesEasy to set upPrecise SMT Process ControlPDR IR Rework

North American specifications may differ

  • Advanced Focused IR component heating
    150W, lens based Focused IR heating with adjustable image system
     
  • Quartz IR PCB preheating
    E6S - 3000W, three zone (360mm x 240mm heating area)
    E6 XL - 3200W, three zone (500mm x 240mm heating area)
     
  • Precision Component Pick and Placement
    Advanced Professional vacuum placement system
     
  • Component Nest/Flux Application Facility
    Integrated nest with flux dip tray or component print frame
     
  • Precision PCB Handling
    Advanced Professional PCB table with macro-micro X/Y
     
  • Component Temperature Sensing
    Standard non-contact IR temperature sensor
     
  • PCB Temperature Sensing
    Standard non-contact IR temperature sensor
     
  • Advanced Thermal Process Control
    Software based auto profile thermal control
     
  • Camera/Prism Based BGA/CSP/QFN Alignment System
    Split beam prism system for simultaneous PCB/component viewing
     
  • Auxiliary Process Camera (Optional)
    High magnification camera and LED lighting
     
  • Forced Air PCB Cooling (Optional)
    Highly effective, integral PCB cooling with air knife system

Technical Specifications

North American specifications may differ

  • Advanced Focused IR component heating
    150W, lens based Focused IR heating with adjustable image system
    PDR lens attachments with IR image from 4 to 70mm diameter
    Reworks all SMDs/ BGAs/QFNs/CSPs including 0201s + lead free applications
     
  • Quartz IR PCB preheating
    High power, medium wave quartz IR
    Large area IR PCB preheater system
    E6S - 3000W, three zone (360mm x 240mm heating area)
    E6 XL - 3200W, three zone (500mm x 240mm heating area)
     
  • PDR    lens attachments
    F150 (Ø4 - 18mm spot size) optional
    F200 (Ø10 - 28mm spot size) standard
    F400 (Ø12 - 35mm spot size) optional
    F700 (Ø25 - 70mm spot size) standard
     
  • Advanced Professional Vacuum Placement System
    With precise ‘pick and place’ action, Y/Z axis movement and rotation
    Soft component landing, Z-axis stop, LED guidance for paste placement
    Interchangeable pick-up heads for different applications
     
  • Component Nest for Precision Pick-up and Flux Application
    With integrated nest with ‘component print frame’, dip tray or mini
    stencil paste-head facility for flux and solder paste application
     
  • Advanced Professional Macro-Micro X/Y PCB Table
    Precision micrometer (micro) X/Y and micro rotation control
    +/- 10 microns (.0004”) movement in X/Y directions
    Macro movement in X/Y directions
    Up to 18” x 24” (460mm x 620mm) PCB capacity with lockable X/Y axis
    X/Y Table has 1” x 1” micro- movement plus macro adjustment
    System has a gantry feature. Topside of machine moves in X and Y direction
     
  • Component Temperature Sensing - Non-contact, IR Sensor
    Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
    Real time monitoring of component temperature throughout process
     
  • PCB Temperature Sensing - Non-contact, IR Sensor
    Manually attached K-type thermocouple probe
    Optional non-contact IR sensor with real time temperature sensing
  • Auto Profile Process Control Software
    PDR ThermoActive software suite
    Digital controller with multi-functional features
    Advanced, Windows 7+ ThermoActive software suite
    Two channel, real time, closed loop component and PCB temperature control
    ‘Auto-profile’ temperature profiling, data logging and reporting
    Multi K-type thermocouple (x4) capacity for temp/time testing
     
  • Camera/Prism Based BGA/CSP/QFN Alignment System
    Split beam prism system for simultaneous PCB/component viewing
    Integral LED lighting system with illumination level control
    Full colour compact camera and flat screen colour monitor
    High quality zoom lens with up to x50 magnification
    Precise X/Y axis mounting system
     
  • Auxiliary Process Camera(Optional)
    Auxiliary process observation camera
    Integral LED lighting system with illumination level control
    Full colour compact camera with rotation movement
    High quality zoom lens with up to x50 magnification
     
  • Forced Air PCB Cooling (Optional)
    Highly effective, integral PCB cooling with air knife system
    Switched compressed air flow, directed under the PCB

Bench Top Requirements

Top heat power150W IR
Back heater power3200W, 2 Zone, 2 x 16700W
Voltage/frequency208-240 volts 50/60Hz, up to 3KW
Typical componentsCSPs, BGAs, uBGAs, QFNs, QFPs,
PLCCs, SOICs, small SMDs
Bench area2000mm (w) x 1000mm (d)
Weight100 Kg

The above features are mostly optional and also, PDR reserves the right to improve or change specifications without giving notice.

 

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PDR IR-E6 Evolution XL

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