IR-D3 Discovery Series
Professional SMD Rework Station for PCBs upto 12"/300mm
The IR-D3 Discovery rework system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield SMD rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.
The IR-D3 can be easily configured to your requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4500 customers.
The IR-D3 system is now available in 2 models - the D3i and D3S. Made in the United Kingdom with only the finest components for optimum precision, the PDR IR-D3 is one of the best performing BGA Rework Stations worldwide.
The PDR IR-D3 systems are available in 2 models – D3i and D3S each configured perfectly for their respective roles.
PDR IR-D3i
Developed from PDR’s pioneering IR rework stations from the 1990-2000s, the IR-D3i, is the standard of the D3 Series. Featuring: Focused IR Component heating, 12” board capabilities with our 2250w 2-zone IR PCB preheating, precision mechanics and software integration. The D3 system is flexible, upgradeable and ideal for general purpose SMD/BGA rework on small-medium sized PCBs.
PDR IR-D3S
The advanced spec IR-D3. All of the great features from the IR-D3i but with added precision optical alignment. this system features our new 2250W 2-Zone IR PCB preheating with a 750W thermoboost heater. Designed for optimum control while still being simple, flexible and reliable to use and operate while reworking small-medium PCB assemblies.
Advanced Features
North American specifications may differ
- Advanced Focused IR component heating
150W, lens based Focused IR heating with adjustable image system
- Quartz IR PCB preheating
2250W, two zone (240mm x 240mm heating area)
Optional 750W, single zone (120mm x 120mm heating area)
- Precision Component Pick and Placement
Professional vacuum placement system
- Component Nest/Flux Application Facility
Optional Jaw mounted nest with flux dip tray or component print frame
- Precision PCB Handling
Professional PCB table with micro X/Y
- Component Temperature Sensing
Standard non-contact IR temperature sensor
- PCB Temperature Sensing
K-type wire thermocouple
Optional non-contact IR temperature sensor
- Advanced Thermal Process Control
Software based auto profile thermal control
- Camera/Prism Based BGA/CSP/QFN
Alignment System (Optional)
Auxiliary process observation camera
- Auxiliary Process Camera (Optional)
Auxiliary process observation camera
Technical Specifications
North American specifications may differ
- Advanced Focused IR component heating
150W, lens based Focused IR heating with adjustable image system
PDR lens attachments with IR image from 4 to 70mm diameter
Reworks all SMDs/ BGAs/QFNs/CSPs including 0201s + lead free applications
- Quartz IR PCB preheating
High power, medium wave quartz IR
Large area IR PCB preheater system
Standard 2250W, two zone (240mm x 240mm heating area)
Optional 750W, single zone (120mm x 120mm heating area)
- PDR lens attachments
F150 (Ø4 - 18mm spot size) optional
F200 (Ø10 - 28mm spot size) optional
F400 (Ø12 - 35mm spot size) optional
F700 (Ø25 - 70mm spot size) standard
- Professional Vacuum Placement System
With precise placement action, Z axis movement and rotation
Soft component landing and Z-axis stop for paste placement
Interchangeable pick-up heads for different application
- Component Nest for Precision Pick-up and Flux Application (Optional)
With jaw mounted nest with ‘component print frame’, dip tray or mini
stencil paste-head facility for flux and solder paste application
- Handheld Component Nest and Flux Application Tool (Optional)
Handheld nest plate with ‘component print frame’ or dip tray
for flux and solder paste application
- Professional Micro X/Y PCB Table
Precision micrometer (micro) X/Y control
+/- 20 microns (.0008”) movement in X/Y directions
Macro movement in X direction
Up to 12” x 12” (300mm x 300mm) PCB capacity with lockable X/Y axis
- Advanced Professional Macro-Micro X/Y PCB Table (Optional)
Precision micrometer (micro) X/Y and micro rotation control
+/- 10 microns (.0004”) movement in X/Y directions
Macro movement in X/Y directions
Up to 12” x 18” (300mm x 450mm) PCB capacity with lockable X/Y axis
- Camera/Prism Based BGA/CSP/QFNAlignment System
Split beam prism system for simultaneous PCB/component viewing
Integral LED lighting system with illumination level control
Full colour compact camera and flat screen colour monitor
High quality zoom lens with up to x50 magnification
Precise X/Y axis mounting system
- Auxiliary Process Camera (Optional)
Auxiliary process observation camera
Integral LED lighting system with illumination level control
Full colour compact camera with rotation movement
High quality zoom lens with up to x50 magnification
- Component Temperature Sensing - Non-contact, IR Sensor (Optional)
Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
Real time monitoring of component temperature throughout process
- PCB Temperature Sensing
Manually attached K-type wire thermocouple
Optional non-contact IR sensor with real time temperature sensing
Bench Top Requirements
| Top heat power | 150W IR |
| Back heater power | 750W or 2250W IR |
| Voltage/frequency | 208-240 volts 50/60Hz, up to 3KW |
| Typical components | CSPs, BGAs, uBGAs, QFNs, QFPs, PLCCs, SOICs, small SMDs |
| Bench area | 1400mm (w) x 600mm (d) |
| Weight | 65 Kg |
The above features are mostly optional and also, PDR reserves the right to improve or change specifications without giving notice.
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