IR-C3 Chipmate
Entry-Level SMD/BGA Rework Station
Today there is a need for lower cost and upgradeable equipment without a loss in soldering quality. The PDR IR-C3 Chipmate SMT/BGA rework station, using PDR’s patented Focused IR technology, have been specifically engineered to meet this challenge.
The IR-C3 Chipmate comes with a good range of standard features allowing the operator to quickly, safely rework all types of components.
The station is tool free, gas free, instantly/precisely controllable, clean, modular and produces 100% yield BGA rework without any complications. The IR-C3 uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4500 customers.
Advanced Features
- Advanced Focused IR component heating
150W, lens based Focused IR heating with adjustable image system
- Quartz IR PCB preheating
2000W, two zone (240mm x 240mm heating area)
- Precision Component Pick and Placement
Professional vacuum placement system
- Precision PCB Handling
Portable Benchtop PCB workholder
- Component Temperature Sensing
Standard non-contact IR temperature sensor
- PCB Temperature Sensing
K-type wire thermocouple
- Advanced Thermal Process Control
Digital based auto profile thermal control
Technical Specifications
- Advanced Focused IR component heating
150W, lens based Focused IR heating with adjustable image system
PDR lens attachments with IR image from 4 to 70mm diameter
Reworks SMDs/ BGAs/QFNs/CSPs + lead free applications
- Quartz IR PCB preheating
High power, medium wave quartz IR
Large area IR PCB preheater system
2000W, single zone (240mm x 240mm heating area)
Optional 750W, single zone (120mm x 120mm heating area)
- PDR lens attachments
F150 (Ø4 - 18mm spot size) optional
F200 (Ø10 - 28mm spot size) optional
F400 (Ø12 - 35mm spot size) optional
F700 (Ø25 - 70mm spot size) standard
- Handheld Vacuum Placement System
Vacuum operated pick up tool, hand held with silicon cups
- Standard Vacuum Placement System (Optional)
With precise placement action, Z axis movement and rotation
Interchangeable pick-up heads for different application
- Handheld Component Nest and Flux Application Tool (Optional)
Handheld nest plate with ‘component print frame’ or dip tray for flux and solder paste application
- Portable Benchtop PCB Workholder
650mm, up to 12” x 10” (300mm x 250mm) PCB capacity
- Component Temperature Sensing - Non-contact, IR Sensor
Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
Real time monitoring of component temperature throughout process.
- PCB Temperature Sensing - Non-contact, IR Sensor (Optional)
Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
Real time monitoring of component temperature throughout process
- Digital, Closed-loop Electronic Control
Digital programmable controller (20 internal profile storage)
Simple key pad setting power/time/temperature controls
2 Channel component and PCB temperature control
Bench Top Requirements
| Top heat power | 150W IR |
| Back heater power | 2000W IR |
| Voltage/frequency | 110-240 volts 50/60Hz |
| Typical components | CSPs, BGAs, uBGAs, QFNs, QFPs, PLCCs, SOICs, small SMDs |
| Bench area | 1200mm (w) x 600mm (d) |
| Weight | 45 Kg |
The above features are mostly optional and also, PDR reserves the right to improve or change specifications without giving notice.
Video
Download Brochure
Social Media
