Ultimate Performance, BGA Rework System
The PDR IR-XT5P SMT/BGA rework system is specifically designed to be ultra-accurate and providing the ultimate performance when repairing today's PCB assemblies.
• Small -medium sized PCBs - SMDs, BGAs, uBGAs
• Software controlled, Focused IR process
• Highly specified, ultra-accurate system
The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.
The IR-XT5P can be easily configured to your requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR's Focused IR technology, first introduced in 1987 and now used worldwide by over 3500 customers.
See also in High-End Rework Stations...
XT5 PL
Large PCB, BGA Rework System
XT5 M
Ultimate Performance, Mobile Phone Rework System
- Focused IR component heating
PDR's patented tool-free IR technology - Quartz IR PCB preheater
Large area (240mm x 240mm) 1600/2000w system - Advanced Precision component pick and placement
Lift from Component nest, plus low force landing and rotation - Component nest/flux application system
Using Flux dip tray or component print frame - Precision X/Y/Theta PCB table
Macro-Micro movement and micrometer adjustment - Auto-profile process control package
With PDR's ThermoActive V4+ software suite - BGA/µBGA alignment
High Magnification, CCTV/prism based system - Auxiliary Process Camera
High Magnification, CCTV based system - Non-contact component temperature sensing
Real time measurement of component temperatures
