Rework Systems
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XT3 M
Low Cost, Mobile Phone Rework System

The PDR IR-XT3M Mobile Phone rework system is specifically designed to be lower
cost but still cope with the challenges of repairing today's mobile phone and PDA assemblies.

• Mobile phone and PDA assemblies - SMDs, BGAs, uBGAs, CSPs
• Software controlled, Focused IR process
• Lower cost, good mechanics

The system is keenly priced, tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.

The IR-XT3M can be easily configured to your requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR's Focused IR technology, first introduced in 1987 and now used worldwide by over 3500 customers.


See also in Mid-End Rework Stations...

XT5 Advantage

Lower Cost, BGA Rework System


 Advanced Features Available

  • Focused IR component heating
    PDR's patented tool-free IR technology
  • Quartz IR PCB preheater
    Confined area (120mm x 120mm) 750w system
  • Precision component pick and placement
    Precise placement plus low force landing and rotation
  • Precision X/Y PCB Workholder
    Macro-Micro movement and micrometer adjustment
  • Auto-profile process control package
    With PDR's ThermoActive V4+ software suite
  • BGA/µBGA alignment
    High Magnification, CCTV/prism based system
  • Auxiliary Process Camera
    High Magnification, CCTV based system
  • Non-contact component temperature sensing
    Real time measurement of component temperatures