IR-E3
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IR-E3 Evolution
Ultimate Performance, BGA Rework System

The PDR IR-E3 Evolution rework system is specifically designed to be ultra-accurate and providing the ultimate performance when repairing today's PCB assemblies.

• Small -medium sized PCBs - SMDs, BGAs, uBGAs
• Software controlled, Focused IR process
• Highly specified, ultra-accurate system

The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.

The PDR IR-E3 Evolution can be easily configured to your requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR's Focused IR technology, first introduced in 1987 and now used worldwide by over 4000 customers.




PDR Rework
 Advanced Features Available

  • Focused IR component heating
    PDR's patented tool-free IR technology
  • Quartz IR PCB preheater
    Large area (240mm x 240mm) 1600/2000w system
  • Advanced Precision component pick and placement
    Lift from Component nest, plus low force landing and rotation
  • Component nest/flux application system
    Using Flux dip tray or component print frame
  • Precision X/Y/Theta PCB table
    Macro-Micro movement and micrometer adjustment
  • Auto-profile process control package
    With PDR's ThermoActive V4+ software suite
  • BGA/µBGA alignment
    High Magnification, CCTV/prism based system
  • Auxiliary Process Camera
    High Magnification, CCTV based system
  • Non-contact component temperature sensing
    Real time measurement of component temperatures