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IR-D3 Discovery

Professional SMD Rework Station for PCBs upto 12"/300mm

PDR IR D3 Discovery

The IR-D3 Discovery rework system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield SMD rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.

The IR-D3 can be easily configured to your requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4000 customers.

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Advanced Features

PDR IR ReworkNo NozzlesEasy to set upPrecise SMT Process ControlPDR IR Rework
  • Advanced Focused IR component heating
    150W, lens based Focused IR heating with adjustable image system
     
  • Quartz IR PCB preheating
    2000W, two zone (240mm x 240mm heating area)
     
  • Precision Component Pick and Placement
    Professional vacuum placement system
     
  • Component Nest/Flux Application Facility
    Optional Jaw mounted nest with flux dip tray or component print frame
     
  • Precision PCB Handling
    Professional PCB table with micro X/Y
     
  • Component Temperature Sensing
    Standard non-contact IR temperature sensor
     
  • PCB Temperature Sensing
    K-type wire thermocouple
    Optional non-contact IR temperature sensor
     
  • Advanced Thermal Process Control
    Software based auto profile thermal control
     
  • Camera/Prism Based BGA/CSP/QFN
    Alignment System (Optional)
    Auxiliary process observation camera
     
  • Auxiliary Process Camera (Optional)
    Auxiliary process observation camera

     

Technical Specifications

  • Advanced Focused IR component heating
    150W, lens based Focused IR heating with adjustable image system
    PDR lens attachments with IR image from 4 to 70mm diameter
    Reworks all SMDs/ BGAs/QFNs/CSPs including 0201s + lead free applications
     
  • Quartz IR PCB preheating
    High power, medium wave quartz IR
    Large area IR PCB preheater system
    Standard 2000W, 2 x 1000W zones (240mm x 240mm heating area)
    Optional 750W, single zone (120mm x 120mm heating area)
     
  • PDR lens attachments
    F150 (Ø4 - 18mm spot size) optional
    F200 (Ø10 - 28mm spot size) optional
    F400 (Ø12 - 35mm spot size) optional
    F700 (Ø25 - 70mm spot size) standard
     
  • Professional Vacuum Placement System
    With precise placement action, Z axis movement and rotation
    Soft component landing and Z-axis stop for paste placement
    Interchangeable pick-up heads for different application
     
  • Component Nest for Precision Pick-up and Flux Application (Optional)
    With jaw mounted nest with ‘component print frame’, dip tray or mini
    stencil paste-head facility for flux and solder paste application
     
  • Handheld Component Nest and Flux Application Tool (Optional)
    Handheld nest plate with ‘component print frame’ or dip tray
    for flux and solder paste application
     
  • Professional Micro X/Y PCB Table
    Precision micrometer (micro) X/Y control
    +/- 20 microns (.0008”) movement in X/Y directions
    Macro movement in X direction
    Up to 12” x 12” (300mm x 300mm) PCB capacity with lockable X/Y axis
  • Advanced Professional Macro-Micro X/Y PCB Table (Optional)
    Precision micrometer (micro) X/Y and micro rotation control
    +/- 10 microns (.0004”) movement in X/Y directions
    Macro movement in X/Y directions
    Up to 12” x 18” (300mm x 450mm) PCB capacity with lockable X/Y axis
     
  • Component Temperature Sensing - Non-contact, IR Sensor
    Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
    Real time monitoring of component temperature throughout process
     
  • PCB Temperature Sensing
    Manually attached K-type wire thermocouple
    Optional non-contact IR sensor with real time temperature sensing
     
  • PCB Temperature Sensing - Non-contact, IR Sensor (Optional)
    Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
    Real time monitoring of component temperature throughout process

Bench Top Requirements

Top heat power 150W IR
Back heater power 1600W or 2000W IR
Voltage/frequency 208-240 volts 50/60Hz, up to 3KW
Typical components CSPs, BGAs, uBGAs, QFNs, QFPs,
PLCCs, SOICs, small SMDs
Bench area 1400mm (w) x 600mm (d)
Weight 65 Kg

The above features are mostly optional and also, PDR reserves the right to improve or change specifications without giving notice.

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PDR IR-D3 Discovery

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