IR C2
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IR-C3 Chipmate
Rework Station

The PDR IR-C3 Chipmate entry level SMT/BGA rework system is specifically designed to be lower cost but still cope with the challenges of repairing today's small, medium sized PCB assemblies.

• Mobile phone and PDA assemblies, laptop repair - SMDs, BGAs, CSPs
• Digital controlled, Focused IR process
• Lower cost, good mechanics

The system is keenly priced, tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs and is ideal for lead-free applications.

The IR-C3 Chipmate can be easily configured to your requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR's Focused IR technology, first introduced in 1987 and now used worldwide by over 4000 customers.


See also in Entry Level Rework Stations...

IR-C1 SolderLight Professional
Precision IR Handtool System for SMT and BGA Rework


 Advanced Features Available

  • Focused IR component heating
    PDR's patented tool-free IR technology
  • IR PCB Preheater
    240mm x 240mm, 2000w system
    (Optional)
    120mm x 120mm, 750w system
    240mm x 240mm. 1600w system
  • Digital Control Package
    With PDR Real Time Temperature Control
  • Non-Contact IR Sensor
    For Measuring Component Temperature
  • Optional - Precision Component Placement
    Low Force Landing and Rotation
  • Optional - BGA/Micro-BGA Alignment
    CCTV/Prism Based System
  • Optional - X/Y Workholder
    X-Y Micro Movement with Micrometer Adjustment
  • Optional - Component Nest and Paste Application Facility
    Print Frame