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IR-C3 Chipmate Series

Entry-Level SMD/BGA Rework Station

IR-C3 Rework System

Today there is a need for lower cost and upgradeable equipment without a loss in soldering quality. The PDR IR-C3 and IR-C3i Chipmate SMT/BGA rework stations, using PDR’s patented Focused IR technology, have been specifically engineered to meet this challenge.

The IR-C3/C3i Chipmate comes with a good range of standard features allowing the operator to quickly, safely rework all types of components.

The station is tool free, gas free, instantly/precisely controllable, clean, modular and produces 100% yield BGA rework without any complications. The IR-C3/C3i uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4500 customers.

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Advanced Features

PDR IR ReworkNo NozzlesEasy to set up
  • Advanced Focused IR component heating
    150W, lens based Focused IR heating with adjustable image system
     
  • Quartz IR PCB preheating
    2000W, two zone (240mm x 240mm heating area)
     
  • Precision Component Pick and Placement
    Professional vacuum placement system
     
  • Precision PCB Handling
    Portable Benchtop PCB workholder
     
  • Component Temperature Sensing
    Standard non-contact IR temperature sensor
     
  • PCB Temperature Sensing
    K-type wire thermocouple
     
  • Advanced Thermal Process Control
    Digital (C3) or Software (C3i) based auto profile thermal control

     

Technical Specifications

  • Advanced Focused IR component heating
    150W, lens based Focused IR heating with adjustable image system
    PDR lens attachments with IR image from 4 to 70mm diameter
    Reworks SMDs/ BGAs/QFNs/CSPs + lead free applications
     
  • Quartz IR PCB preheating
    High power, medium wave quartz IR
    Large area IR PCB preheater system
    2000W, single zone (240mm x 240mm heating area)
    Optional 750W, single zone (120mm x 120mm heating area)
     
  • PDR lens attachments
    F150 (Ø4 - 18mm spot size) optional
    F200 (Ø10 - 28mm spot size) optional
    F400 (Ø12 - 35mm spot size) optional
    F700 (Ø25 - 70mm spot size) standard
     
  • Handheld Vacuum Placement System
    Vacuum operated pick up tool, hand held with silicon cups
     
  • Standard Vacuum Placement System (Optional)
    With precise placement action, Z axis movement and rotation
    Interchangeable pick-up heads for different application
     
  • Handheld Component Nest and Flux Application Tool (Optional)
    Handheld nest plate with ‘component print frame’ or dip tray for flux and solder paste application
     
  • Portable Benchtop PCB Workholder
    650mm, up to 12” x 10” (300mm x 250mm) PCB capacity
     
  • Component Temperature Sensing - Non-contact, IR Sensor
    Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
    Real time monitoring of component temperature throughout process.
  • PCB Temperature Sensing - Non-contact, IR Sensor (Optional)
    Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
    Real time monitoring of component temperature throughout process
     
  • Digital, Closed-loop Electronic Control (IR-C3)
    Digital programmable controller (20 internal profile storage)
    Simple key pad setting power/time/temperature controls
    2 Channel component and PCB temperature control
  • Auto Profile Process Control Software (IR-C3i)
    Advanced PDR ThermoActive software suite, Windows 7+
    Digital controller with multi-functional features
    Two channel, real time, closed loop component and PCB temperature control
    ‘Auto-profile’ temperature profiling, data logging and reporting
    Optional PC System with 17-23-27” Monitor Selection

 

Bench Top Requirements

Top heat power150W IR
Back heater power2000W IR
Voltage/frequency110-240 volts 50/60Hz
Typical componentsCSPs, BGAs, uBGAs, QFNs, QFPs,
PLCCs, SOICs, small SMDs
Bench area1200mm (w) x 600mm (d)
Weight45 Kg

The above features are mostly optional and also, PDR reserves the right to improve or change specifications without giving notice.

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IR-C3 Chipmate

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